The HX8N0 series of fully automatic probe table equipment is specialized for the performance testing of all kinds of devices at the wafer level of 8 inches，Can be tested against different wafers，Can be equipped with appropriate instruments，The characteristics of I-V, C-V and optical signals are analyzed，Equipment features，Can match a variety of test application environments，Can upgrade high-power wafer testing, RF testing, fully automatic testing and can load temperature control system，To meet customer requirements for various wafer device performance testing in high and low temperature environments。

Product characteristics
• Save space;
• Full closed loop linear motor motion control;
• High precision and test speed, greatly improving test efficiency;
• Meet high voltage and high current test;
• Upgradable automatic wafer thickness measurement and ID reader card。

Software function introduction
• Can test wafer, test range is optional, support interlace sampling and ring test, MAP map can be edited test;
• Support bad point retest;
• With offline and synchronous functions;
• With contact buffer function, stable needle marks;
• Run feedback function to ensure the stability of the test;
• Test yield, total, speed display;
• CCD image automatic alignment and positioning;
• CCD automatic needle function;
• With automatic needle cleaning and sharpening functions;
• Have a certain anti-interference ability;
• Multi-bin classification test, test data can be stored, can be exported, compatible with the format of post-channel devices, with data statistical analysis function;
• Operator, administrator, system manufacturer rights management function;
• Support TTL, 232, GPIB and other common protocols。

Parameters and indicators: